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Manufacturer : NXP USA Inc.
Manufacturer Part No : MC9S08PA4VWJ
Enrgtech Part No : ET10838301
Product Range : PolySwitch RXEF Series

NXP USA Inc. MC9S08PA4VWJ

IC MCU 8BIT 4KB FLASH 20SOIC

Product Information

HTSUS : 8542.31.0001
RoHS Status : ROHS3 Compliant
Program Memory Size : 4KB (4K x 8)
Peripherals : LVD, POR, PWM, WDT
Operating Temperature : -40°C ~ 105°C (TA)
Voltage - Supply (Vcc/Vdd) : 2.7V ~ 5.5V
Package / Case : 20-SOIC (0.295", 7.50mm Width)
RAM Size : 512 x 8
Program Memory Type : FLASH
REACH Status : REACH Unaffected
isNormallyStocking :
Connectivity : LINbus, SPI, UART/USART
rohs : ROHS3 Compliant
Package : Tube
EEPROM Size : 128 x 8
Oscillator Type : Internal
Moisture Sensitivity Level (MSL) : 3 (168 Hours)
Number of I/O : 18
Product Status : Not For New Designs
Core Size : 8-Bit
Mounting Type : Surface Mount
Series : S08
Supplier Device Package : 20-SOIC
Data Converters : A/D 8x12b
Mfr : NXP USA Inc.
Core Processor : S08
Speed : 20MHz
Base Product Number : MC9S08
ECCN : 3A991A2

Technical Documents

  • NXP USA Inc REACH (Environmental Information)
  • NXP USA Inc RoHS Cert (Environmental Information)
  • Mult Dev Site Chgs 18/Dec/2020 (PCN Assembly/Origin)
  • MC9S08Py Series Datasheet Rev 3/Aug/2020 (PCN Design/Specification)
  • Mult Dev 25/May/2020 (PCN Design/Specification)
  • MC9S08PA4 Datasheet (Datasheets)
  • Mult Dev Pkg Seal 15/Dec/2020 (PCN Packaging)
  • All Dev Label Update 15/Dec/2020 (PCN Packaging)
  • MC9S08PA4 Mask Errata (Errata)

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